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Connect New 800G Sites to Legacy 400G Sites via 2x400G Breakout
Built-in Broadcom 7nm DSP Chip,Max.Power Consumption 16.5W
Self-developed 53G EML Laser Chip to Ensure Production
Parameter Tests for Superior Performance, Quality, and Reliability
Support 2x400G or 8x100G Breakout for Higher Port Density
8x106.25G PAM4 Retimed 800GAUI-8 Electrical Interface
High-speed Connectivity Compliant to IEEE 802.3ck and IEEE 802.3cu-2021
Hot Pluggable OSFP MSA Compliant
NVIDIA Ethernet Compatible | MMS4X00-NM | Vendor Name | Imorecable |
Form Facyor | OSFP Finned Top | Max Data Rate | 850Gbps(8x 106.25Gbps) |
Wavelength | 1310nm | Max Cable Distance | 500m |
Connector | Dual MTP/MPO-12 APC | Media | SMF |
Transmitter Type | EML | Receiver Type | PIN |
TX Power | -2.9 ~ 4.0dBm | Minimum Receiver | 5dBm |
Power Consumption | ≤16.5W | Extinction Ratio | >3.5dB |
Modulation(Electrical) | 8x 106.25Gb/s PAM4 | Modulation(Optical) | Two ports 4x 106.25Gb/s PAM4 |
Packaging Technology | COB(Chip on Board)Packaging | Modulation Format | PAM4 |
CDR(Clock and Data Recovery) | TX & RX Built-in DSP | Inbuilt FEC | No |
Protocols | IEEE802.3ck,IEEE 802.3cu,OSFP MSA | Werranty | 5 Years |